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SHORT RUN AND
HIGH VOLUME

PROGRAMS

 


CUSTOM CIRCUIT MANUFACTURING
SIP And DIP PACKAGING AVAILABLE

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Capital maintains an extensive capability to produce custom Surface Mount circuit modules in both SIP (single-In-Line Package) and DIP (Dual-In-Line Package). We can provide all required design and tooling services and produce your circuits in volumes ranging from a few dozen to a few hundred thousand. Custom circuits produced range from simple component arrays and networks to complex circuit modules.

Please  contact us  to discuss your needs.

 


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 (c)    Copyright 1999 - 2011  Capital Advanced Technologies, Inc.  ALL RIGHTS RESERVED

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