CAPITAL ADVANCED TECHNOLOGIES, INC.


Home
Up

 

 

 

 

 

 

HOW-TO

 


MIX SURFACE MOUNT AND LEADED PARTS
WHY NOT GET THE BEST OF BOTH WORLDS.


In real world prototype, test, and circuit development, as well as when building circuit upgrades or modifications, the need arises to be able to use both the Surface mount and conventional leaded component technologies.
Several Surfboard models for I.C.s, discrete devices, and application specific adapters feature Single-In-Line (SIP) pins on .100 in. centers. This means your assemblies are compatible with both conventional and solderless breadboards as well as sockets.

bbmt01.gif (11745 bytes)

sbus01.gif (5128 bytes)


The assembly on left shows a Surfboard Sub-assembly plugged into a socket strip mounted on a UNI-SIP (through-Hole) breadboard module, which in turn features SIP pins for plug-in convenience. Uni-Sip boards can serve as mini-mother boards for Surfboard assemblies.


Surfboards can also be modified by drilling holes to accept leaded devices where needed. A wide range of hybridization's are possible with simple modifications. The example circuits on the right show larger leaded devices mounted topside, while the Surface Mount devices are on the bottom.

msmth01.gif (2144 bytes)msmth02.gif (4240 bytes)

 


HOME         PRODUCTS        SEARCH          SITE MAP        RoHS/LEAD FREE

 

RoHS COMPLIANT
PRODUCTS
AVAILABLE

CONTACT US    E-MAIL    ABOUT US   DISTRIBUTORS

TERMS OF USE       LEGAL NOTICE        TRADEMARKS

 

 ©    Copyright 1999 - 2008  Capital Advanced Technologies, Inc.  ALL RIGHTS RESERVED